Magnetron sputtering vacuum coating machine which factors lead to uneven? Specializing in this work friend actually quite understanding, which can be divided into the following factors is: a vacuum, magnetic field, argon.
Magnetron sputtering vacuum coating machine is operating under vacuum state by electron bombardment orthogonal magnetic field is formed by argon ions of argon and then bombard the target, the target ions deposited on the surface film.
Vacuum pumping system is required to control, each exhaust port and consistent efforts must operate simultaneously, so you can control the uniformity pumping, if the pumping uneven pressure in the vacuum chamber can not be made uniform, pressure on the movement of ions there is a certain impact. But also control additional pumping time, too short will cause a vacuum is not enough, but it is too long and a waste of resources, but there exists a vacuum gauge, to control the problem or not.
Magnetic field is orthogonal to the operation, but you want a uniform magnetic field strength to achieve one hundred percent is impossible, the general magnetic field strong place, film thickness is large, on the contrary it is small, it will cause inconsistencies film thickness , but in the production process, the situation of the film due to the inhomogeneous magnetic field is not the result of uneven common, why?
The original magnetic field strength is not good, but at the same time, the workpiece is in operation at the same time, and is a target atom sedimentary end of the case for many times coating process, parts for a period of time though thick and thin parts, but another time, under the action of strong magnetic field on the thin parts of the original sedimentary thickness, on the thickness of the part of the thin, so many times, after the whole film layer eventually into film, uniformity is good.
Uniformity of argon gas will affect the uniformity of the film, its principle is actually very similar to the vacuum degree, because of argon gas into the vacuum chamber pressure changes, the size can be controlled into uniform pressure vacuum magnetron sputtering coating machine film thickness uniformity.
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